Despite the numerous benefits offered by 2.5D/3D integration, testing remains a major obstacle that hinders its widespread adoption. Concerns related to test cost, yield and reliability continue to derail the commercial exploitation of 2.5D/3D ICs. Test techniques and design-for-testability (DfT) solutions are now being explored in the research community, with considerable focus on wafer probing, pre-bond test of passive interposers, test access to modules in stacked dies, cost modeling and the targeting of new defect types. In this talk, the speaker will examine the hype, myths and realities of 2.5D/3D ICs. He will reflect on some of the over-hyped claims and describe some of the myths that have been exposed in recent years. He will present a reality check on testing and DfT challenges and describe some of the recent solutions being advocated for these challenges. The key questions to be addressed are: “What to Test? How to Test? When to Test?” To answer these questions, the presentation will cover pre-bond testing of TSVs and interposers, DfT solutions and optimization for stack testing, test-flow selection and test solutions for monolithic 3D integration.
Krishnendu Chakrabarty received a BTech degree from the Indian Institute of Technology, Kharagpur, and MSE and PhD degrees from the University of Michigan, Ann Arbor. He is now the Fulton Professor of Microelectronics in the School of Electrical, Computer and Energy Engineering at Arizona State University (ASU) and chief technology officer (CTO) of the Department of Defense Microelectronics Commons Southwest Advanced Prototyping (SWAP) Hub. He is also the director of the ASU Center on Semiconductor Microelectronics. Before joining ASU, he was the John Cocke Distinguished Professor and Department Chair of Electrical and Computer Engineering (ECE) and professor of computer science at Duke University. He was a visiting professor at NVIDIA for seven months during 2022-2023.
Prof. Chakrabarty is a recipient of the National Science Foundation CAREER award, the Office of Naval Research Young Investigator award, the Humboldt Research Award from the Alexander von Humboldt Foundation, Germany, the IEEE Transactions on CAD Donald O. Pederson Best Paper Award, the IEEE Transactions on VLSI Systems Prize Paper Award, the ACM Transactions on Design Automation of Electronic Systems Best Paper Award, multiple IBM Faculty Awards and HP Labs Open Innovation Research Awards and over a dozen best paper awards at major conferences. He is also a recipient of the IEEE Computer Society Technical Achievement Award, the IEEE Circuits and Systems Society Charles A. Desoer Technical Achievement Award, the IEEE Circuits and Systems Society Vitold Belevitch Award, the Semiconductor Research Corporation Technical Excellence Award, the Semiconductor Research Corporation Aristotle Award, the IEEE-HKN Asad M. Madni Outstanding Technical Achievement and Excellence Award and the IEEE Test Technology Technical Council Bob Madge Innovation Award. He is a research ambassador of University of Bremen (Germany) and he was a Hans Fischer Senior Fellow at the Institute for Advanced Study, Technical University of Munich, Germany during 2016-2019. He is a recipient of the Japan Society for the Promotion of Science (JSPS) Invitational Fellowship in the “Short Term S: Nobel Prize Level” category. He received the Distinguished Alumnus Award from the Indian Institute of Technology, Kharagpur.
Prof. Chakrabarty’s current research projects include: design-for-testability of 2.5D/3D integrated circuits and heterogeneous integration; AI accelerators; microfluidic biochips; hardware security; AI for healthcare. He is a Fellow of ACM, IEEE, and AAAS and a Golden Core Member of the IEEE Computer Society. He was a member of the DARPA Microsystems Exploratory Council during 2022-2023. He is a member of the Scientific Advisory Board of the Deutsches Forschungszentrum für Künstliche Intelligenz (German Research Center for Artificial Intelligence). Prof. Chakrabarty served as the editor-in-chief of IEEE Design & Test of Computers during 2010-2012, ACM Journal on Emerging Technologies in Computing Systems during 2010-2015 and IEEE Transactions on VLSI Systems during 2015-2018.