ECE 554

Electronic Packaging Principles

Usually offered: Fall

Required course: No

Course Level

Graduate

Units

3

Course Description

Introduction to problems encountered at all levels of packaging: thermal, mechanical, electrical, reliability, materials and system integration. Future trends in packaging. 

Also offered as AME 554 and MSE 554.

Contact Graduate Advisors:
Tami Whelan
PhD advisor for CSE, ECE and SFWE
phdgradadvisor@ece.arizona.edu

Jorge Camarillo
MS advisor for CSE, ECE, SFWE
msgradadvisor@ece.arizona.edu

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