ECE Seminar: Ahmet Cemal Durgun
Wednesday, Feb. 23, 2022 | 3:15 – 4:30 p.m. MST
Ahmet Cemal Durgun
Assistant Professor
Electrical & Electronics Engineering
Middle East Technical University, Ankara, Turkey
"Machine Learning Applications for Signal Integrity
ECE 530 or Zoom
For additional information, contact Dr. Hao Xin
Abstract:
In today's microelectronic industry, the increasing demand for higher computational power to process the rapidly growing data load in the network results in a significant boost in bandwidth requirements. To be able to cope with this demand and sustain a healthy communication and computing network, the system capacity and speed should also be scaled accordingly. This can be achieved either by scaling the data rate or the number of lines as in serial and parallel input/output interfaces, respectively. Regardless of the selected approach, the microelectronic package designs and overall system integration process becomes more complex because of several designs and signal integrity challenges. To address these challenges and decrease the time to market with efficient design cycles, accurate and fast electromagnetic modeling of the interconnects is very crucial. In this seminar, we will talk about how machine learning methods can be applied to electromagnetic modeling of interconnects to improve the design cycles of advanced packages.
Disclaimer: "This talk is financially supported by the 2232 International Fellowship for Outstanding Researchers Program of TUBITAK (Project No: 118C198). The views, opinions and/or findings expressed are those of the speaker and should not be interpreted as representing the official views or policies of TUBITAK."
Biography:
Ahmet Cemal Durgun received his Ph.D. degree in Electrical Engineering from Arizona State University, Tempe, AZ, USA, in 2013. From 2014 to 2020, he was with the Intel Corporation, Assembly and Test Technology Development, Chandler, AZ, USA, where he worked on the development of innovative microelectronic packaging solutions for high-speed I/O interfaces, very fine pitch interconnects, and signal integrity of chip-to-chip communication channels. In 2020, he joined the Electrical and Electronics Engineering Department at Middle East Technical University, Ankara, Turkey, where he is currently working as an Assistant Professor. His research interests include applied electromagnetics, microelectronic packaging, signal and power integrity of high-speed I/O interfaces, fine pitch interconnects for 2.5-D and 3-D integration, and machine learning applications of packaging and electromagnetic problems. Dr. Durgun is also a Guest Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.